Case Study | CIS Improves Quality Inspection for Semiconductor Lead Frames
Facing the needs of small space, high-precision and multi-specification inspection in lead frame production, the LineX CIS imaging solution supports online defect inspection and process traceability.
case background
The production of semiconductor lead frames involves processes such as laser drilling, copper plating, wiring and lamination. The previous website case introduces the detection needs of online visual inspection for problems such as hole defects, burrs and residue, as well as the challenges brought by compact installation space and multi-specification product replacement.
programme highlights
LineX CIS macro imaging solution adopts an integrated design, combining high-resolution imaging without the need for multi-camera stitching to support the transformation of existing production lines. Inspection results can be used to trace defect types, location distribution and process issues.
This article is an editorial summary of the previous website case. Please read the original text for complete technical parameters, application pictures and customer feedback.